TECHNOLOGIES
MICROELECTRONICS
Our Microelectronics Group has handled large, complex projects, including
the installation of a 20,000 square foot, zero-discharge, electroplating
facility in Southern California.
IC Design and Foundry Management
Package Modeling / Design
- 3D + 2.5D EM Simulations
- Thermal Simulations
- Physical Layout
- Various Materials (Metal (Al 6061, A-40, Kovar, Invar,
etc.), HTCC, LTCC, Laminate and High-Temperature LCP)
Assembly
Processes
- Die Attachment (Pick and Place, Epoxy and
Solder, and Flip Chip)
- Wire and Ribbon Bonding
- Cleaning (Plasma, Solvent Degreasing, etc.)
- Rack and Real-to-Real Plating
- Feedthroughs
- Lidding (Epoxy, Laser Welding, Seam Welding)
- Injection Molding
- Ultrasonic Welding
Testing
- RF and Reliability
- Specialized Test Fixtures and Test Sets
Qualification
- Military (JEDEC STD-22, MIL-STD-883, etc.)
- Commercial
© 2009 Torrey Pines Technologies Group, Inc. | 12225 World Trade Drive, Suite P | San Diego, CA 92128 | (858) 676-0749 phone | (858) 676-0759 fax | Employee Webmail
